Polished Stainless Steel Wafers

Search

Advanced Search Powered by KSearch 1.5b

Polished Stainless Steel Wafers

Stainless steel wafers are manufactured to standard SEMI diameter specifications from 304, 316 and 430 stainless steel.

Typical wafer thicknesses are 0.005" (125µm), 0.010" (250µm), 0.015" (375µm), 0.020" (500µm), 0.025" (625µm) and 0.040" (1mm).
430 Stainless steel is magnetic, while 304 Stainless steel is slightly magnetic, and 316 stainless is non-magnetic.

Applications for Stainless steel wafers, substrates and foils include:

  • Thick-film pressure sensors
  • Thick-film resistors
  • Thick-film heater substrates
  • Temperature sensing elements
  • Flexible substrate applications
  • Research and development
  • Substrates for CIGS - Copper, Indium, Gallium Diselenite thin films

Other related web pages::

Return to Home Page: Lapping, contract precision flat lapping and polishing

Updated: 22 Jan 2009

Conversion Calculator

VALLEY DESIGN NEWS

Return to top of page