Lapping and Polishing Wafer Chucks, Reconditioning

Lapping and Polishing Wafer Chucks, Reconditioning

Valley Design has over 30 years experience in vacuum chuck manufacturing and reconditioning. Advanced wafer chucks produced ultra-flat, with Angstrom level surface finishes and parallel to less than 1 micron (40 millionths of an inch) is attainable.

Vacuum chucks, also called Wafer vacuum chucks can be used for:

• Inspection
• Lithography
• Wafer Dicing

Wafer dicing chucks are used to hold wafers on various models of dicing saws including Diso, K&S and others.

Wafer chuck material:

• Aluminum
• Hardcoated Aluminum
• Silicon Carbide
• Ceramic
• Titanium Oxide
• Stainless Steel

Typical Specifications for vacuum chucks

• Size: up to 300mm (12^") and larger
• Flatness: to 1/2 light band (λ/4) - depending on size
• Parallelism: to 1 micron and less is possible
• Surface finish: Angstrom level - depending on material

Please call or e-mail for a quotation to meet your requirements.

Wafer chuck related web sites:

• www.flatlapping.com/end-effectors Robotic end effectors lapped and polished
• www.flatlapping.com/single-sided Single-side lapping
• www.flatlapping.com/double-sided Double-side lapping for parallelism and flatness
• www.flatlapping.com/wafer-chucks Wafer chuck lapping and polishing

Return to Home Page: Lapping, contract precision flat lapping and polishing

Updated: 19 October 2010

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