Lapping and Polishing Wafer Chucks, Reconditioning, CNC Machining
Valley Design has over 30 years experience in vacuum chuck manufacturing, reconditioning and CNC machining. Advanced wafer chucks are produced ultra-flat with Angstrom level surface finishes, and parallellism to less than 1 micron (40 millionths of an inch) is attainable.
Vacuum chucks, also called Wafer vacuum chucks can be used for:
- Wafer Dicing
Wafer dicing chucks are used to hold wafers on various models of dicing saws including DISCO, K&S and others.
Wafer chuck material:
- Hardcoated Aluminum
- Silicon Carbide
- Titanium Oxide
- Stainless Steel
Typical Specifications for vacuum chucks
- Size: up to 450mm diameter (12") and larger
- Flatness: to 1/2 light band (λ/4) - depending on size
- Parallelism: to 1 micron and less is possible
- Surface finish: Angstrom level - depending on material
Please call or e-mail for a quotation to meet your requirements.
Wafer chuck related web sites: