Lapping and Polishing Wafer Chucks, Reconditioning

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Lapping and Polishing Wafer Chucks, Reconditioning

Valley Design has over 30 years experience in vacuum chuck manufacturing and reconditioning. Advanced wafer chucks produced ultra-flat, with Angstrom level surface finishes and parallel to less than 1 micron (40 millionths of an inch) is attainable.

Vacuum chucks, also called Wafer vacuum chucks can be used for:

  • Inspection
  • Lithography
  • Wafer Dicing

Wafer dicing chucks are used to hold wafers on various models of dicing saws including Diso, K&S and others.

Wafer chuck material:

  • Aluminum
  • Hardcoated Aluminum
  • Silicon Carbide
  • Ceramic
  • Titanium Oxide
  • Stainless Steel

Typical Specifications for vacuum chucks

  • Size: up to 300mm (12^") and larger
  • Flatness: to 1/2 light band (λ/4) - depending on size
  • Parallelism: to 1 micron and less is possible
  • Surface finish: Angstrom level - depending on material

Please call or e-mail for a quotation to meet your requirements.

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Updated: 19 October 2010